产品中心

Thermal Management

It is widely recognized in the electronics industry that thermal interface materials (TIMs) are crucial in maintaining reasonable life & reliability of many heat generating electronic components.

Glocom’s line of high performance TIMs can provide design engineers with solution of thermal management problems.

Glocom’s TIMs offer a wide range thermal performance & physical properties, and can resolve even the most challenging thermal problems. They have already been widely used in various electronic equipments/ components including:

• Advanced Micro-Processors
• High Speed Memory Modules
• Micro Heat Pipes Assemblies
• LED Lighting

As electronic components require increasing watt densities, Glocom’s line of high performance TIM can provide Design Engineers with solutions to thermal management problems. We offer a wide range of thermal performance and physical properties, and can resolve even the most challenging thermal problems.

Coupled with the capability of die-cutting into any shapes & sizes, Glocom provides user with cost effective & easy-to-use thermal management solutions.

Our range of products:

• Thermal Grease
• Insulator
• Phase Change (PCM)
• Gap Fillers

THERMAL GREASE

Thermal grease is used with dispensing equipment and screen printing applications for high volume production.

THERMAL PUTTY

Thermal putty is use where thermal grease is an issue due to orientation or contamination, however thermal putty can stll be dispensed like grease for high volume production.

Typical Applications Include:

• Heat source to heat spreader/ heat sink
• Power supplies
• Audio and video components
• Automotive control units

INSULATOR

Thermally conductive and electrically insulator material is used where high voltage protection for components must be maintained.

Typical Applications include:

• Automotive control units
• Power supplies
• Audio and video components
• Power semiconductors

PHASE CHANGE

Phase change materials (pcm’s) are normally used where thermal grease is an issue due to orientation or contamination.

Typical Applications include:

• Microprocessors
• Heat Sinks
• Power supplies
• Heat Spreaders
• gap_pads1

GAP FILLER

Thermal gap pads are commonly used to bridge components to a heat sink or chassis.

Typical Applications include:

• Mass storage devices
• Telecommunications hardware
• Notebook computers
• Power supplies